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國立陽明交通大學國際半導體產業學院

COURSE

Semiconductor and electronic technologies are rapidly advancing and widely applied across various domains. To cultivate the next generation of globally competitive semiconductor professionals, our college offers a fully English-taught curriculum, organized into two major areas: Semiconductor Materials and Solid-State Electronic Devices, and Semiconductor IC Design and Micro-System Integration.
The college is committed to developing high-level talent with strong global mobility. Our research focuses on semiconductor materials, solid-state electronic devices, advanced system packaging, integrated circuit design, and heterogeneous system integration. To ensure that students are industry-ready, most master’s and doctoral theses are conducted in collaboration with industry partners and focus on cutting-edge technologies. The curriculum and thesis training are designed to equip students with the following core competencies, including both professional expertise and fundamental skills:
 
I. Expertise
  • Ability to independently explore, solve problems, and innovate in semiconductor technologies or circuit-related fields over the next 5–10 years. 
  • Solid understanding of quantum physics, semiconductor physics, and their applications. 
  • Professional knowledge and skills in IC fabrication processes and integrated circuit design. 
  • Practical ability to apply technologies such as 3D ICs, MEMS, advanced packaging, and sensing devices, with expertise in heterogeneous system integration. 
  • Understanding of key semiconductor processing equipment (e.g., lithography, diffusion, thin-film deposition, chemical mechanical polishing) and characterization/measurement tools (e.g., thin-film thickness, electrical, physical, and chemical property analysis). 
II. Diversified Learning
  • Awareness of cross-cultural perspectives and global semiconductor industry trends, with continuous enhancement of international competitiveness. 
  • Ability to write academic papers and deliver presentations in a clear and professional manner, with an international perspective and the capability to engage with global standards. 
  • Ability to participate in multinational R&D teams, integrate information, communicate and coordinate effectively, and demonstrate creativity. 
  • Adherence to engineering ethics, regulations, and intellectual property rights.
III. International Vision
  • Understanding the pulsation of the world's semiconductor-related industries.
  • Chinese and English composition and presentation abilities in science and technology.
  • Intercultural communication and cooperation capabilities.
The curriculum is organized into two major research areas: Semiconductor materials and device technologies and Semiconductor IC design and Micro-system Integration.
The Semiconductor Materials and Device Technologies curriculum focuses on post-Moore era developments, covering both More Moore and More than Moore directions. The former emphasizes advanced process technologies, device scaling, novel transistor architectures, and advanced materials. The latter highlights application-driven technologies such as quantum devices, power devices (SiC, GaN), sensors, and biochips, integrated with advanced packaging and heterogeneous integration to support diverse application needs.
The Semiconductor IC Design and Micro-System Integration curriculum addresses emerging trends such as artificial intelligence, high-performance computing, 6G communications, and smart applications. It focuses on both device-level circuit design and system-level architecture integration. Courses include low-power design, AI chip design, 3D ICs, and chiplet technologies, aiming to equip students with the ability to design high-performance chips and integrated systems. Core foundational courses include Digital Integrated Circuits and Analog Integrated Circuits, with advanced topics such as memory design, RF, and millimeter-wave circuit design.
For detailed course schedules, content, and syllabi, please refer to the NYCU course timetable. 
The graduation credits, course requirements, and related academic regulations shall follow the “Course Requirements for Master’s and Doctoral Programs” announced by the Curriculum Division for the student’s year of admission.
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