{"subject":"Jointly Appointed Professor","pubUnitName":null,"posterDate":null,"updateDate":null,"detailContent":"\r\n
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Chang, Edward Yi
\r\n\t\t\tProfessor
\r\n\t\t\tDepartment of Materials Science and Engineering, NYCU
\r\n\t\t\tEmail: edc@nycu.edu.tw
\r\n\t\t\tResearch Area: III-V/Si device integration, submillimeter-wave InGaAs high-frequency devices, GaN-on-Si high-power device epitaxy and processing, GaN high-frequency device epitaxy and processing

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Tseng, Yuan-Chieh
\r\n\t\t\tChair Professor
\r\n\t\t\tDepartment of Materials Science and Engineering, NYCU
\r\n\t\t\tEmail: yctseng1978@nycu.edu.tw
\r\n\t\t\tResearch Area: Magneto-Resistive Random Access Memory (MRAM), Spintronics, Development of Epitaxial Spintronics, Magnetic Sensors, Magnetic Semiconductors, Reliability of Electronic Devices, Synchrotron Radiation on Materials Characterizations

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Chang, Jeng-Kuei
\r\n\t\t\tChair Professor
\r\n\t\t\tDepartment of Materials Science and Engineering, NYCU
\r\n\t\t\tEmail: jkchang@nycu.edu.tw
\r\n\t\t\tResearch Area: Energy Storage Technology, Energy Materials, Electrochemistry, Ionic Liquid Electrolytes

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Huang, E-Wen
\r\n\t\t\tProfessor
\r\n\t\t\tDepartment of Materials Science and Engineering, NYCU
\r\n\t\t\tEmail: ewenhuang@nycu.edu.tw
\r\n\t\t\tResearch Area: Additive Manufacturing (3D Printing), Metal Inspection and Applications, Research on High-entropy Materials
Chen, Chih
\r\n\t\t\tChair Professor
\r\n\t\t\tDepartment of Materials Science and Engineering, NYCU
\r\n\t\t\tEmail: chihchen@nycu.edu.tw
\r\n\t\t\tResearch Area: Electromigration and Metallurgical Reactions in Flip-chip Solder Joints, 3D IC Packaging, Fabrication & Application of Nanotwinned Cu, Low-temperature Cu-to-Cu Direct Bonding
Chung, Tsai-Fu
\r\n\t\t\tAssistant Professor
\r\n\t\t\tDepartment of Materials Science and Engineering, NYCU
\r\n\t\t\tEmail: tfchung@nycu.edu.tw
\r\n\t\t\tResearch Area: Aberration-corrected Electron Microscopy, Synchrotron Small-angle X-Ray Scattering, Atomic-scale Microstructure Analysis, Design & Analysis of High-strength Aluminum Alloys/High-entropy Alloys and Duplex Stainless Steels, Analysis of Quantum Dots, 2D Materials, and Ancient Artifacts
Lo, You‑Chieh
\r\n\t\t\tAssociate Professor
\r\n\t\t\tDepartment of Materials Science and Engineering, NYCU
\r\n\t\t\tEmail: yclo@nycu.edu.tw
\r\n\t\t\tResearch Area: Materials Mechanical Behavior, Computational Materials Science, Nanomaterials, Structural Materials, Nanotechnology
Chen, Kuan-Neng
\r\n\t\t\tChair Professor
\r\n\t\t\tDepartment of Electronics Engineering, NYCU
\r\n\t\t\tEmail: knchen@nycu.edu.tw
\r\n\t\t\tResearch Area: Three-Dimensional Integrated Circuits (3D ICs), Heterogeneous integration technologies and components, Advanced Packaging Technology
Wen, Kuei-Ann
\r\n\t\t\tProfessor
\r\n\t\t\tDepartment of Electronics Engineering, NYCU
\r\n\t\t\tEmail: twtstella@gmail.com
\r\n\t\t\tResearch Area: Integrated Circuits & Systems, Digital Communications, Electronic Circuit Design
Chien, Chao-Hsin
\r\n\t\t\tProfessor
\r\n\t\t\tDepartment of Electronics Engineering, NYCU
\r\n\t\t\tEmail: chchien@nycu.edu.tw
\r\n\t\t\tResearch Area: Advanced Nano-device Gate Engineering, Organic Thin-film Devices and Memories, Nanocrystalline Memory and Its Quantum Phenomena, Si-Ge and III-V Compound High-mobility Devices
Chen, Hung-Ming
\r\n\t\t\tProfessor
\r\n\t\t\tDepartment of Electronics Engineering, NYCU
\r\n\t\t\tEmail: hmchen@nycu.edu.tw
\r\n\t\t\tResearch Area: Digital-analog Circuit Design Automation, Algorithm Design, Analysis & Optimization, Co-design of Chip Packaging Systems
Horng, Ray-Hua
\r\n\t\t\tChair Professor
\r\n\t\t\tDepartment of Electronics Engineering, NYCU
\r\n\t\t\tEmail: rayhua@nycu.edu.tw
\r\n\t\t\tResearch Area: Solid-state Lighting Devices, Solar Cells, Power Device, HEMT, Flexible Electronics, Optoelectronics, Nitride and Oxide Semiconductor MOCVD Growths
Hou, Tuo-Hung
\r\n\t\t\tChair Professor
\r\n\t\t\tDepartment of Electronics Engineering, NYCU
\r\n\t\t\tEmail: thhou@nycu.edu.tw
\r\n\t\t\tResearch Area: Nonvolatile Memory, Electronic Synapse and Neuromorphic Computation, Metal-oxide Thin-film Transistor, Two-dimensional Layered Materials and Devices, Nanotechnology, Semiconductor Device Physics
Po-Hung Chen
\r\n\t\t\tProfessor
\r\n\t\t\tDepartment of Electronics and Electrical, NYCU
\r\n\t\t\tEmail: hakko@nycu.edu.tw
\r\n\t\t\tResearch Area: Power management integrated circuit、Energy harvesting IC、Wireless charging、SiC/GaN gate driver and converter
Chen, Wei-Zen
\r\n\t\t\tProfessor
\r\n\t\t\tInstitute of Electronics, NYCU
\r\n\t\t\tEmail: wzchen@nycu.edu.tw
\r\n\t\t\tResearch Area: Mixed-signal IC Design, High-frequency Circuit Design, Communication Systems
Liu, Chien-Nan Jimmy
\r\n\t\t\tProfessor
\r\n\t\t\tInstitute of Electronics, NYCU
\r\n\t\t\tEmail: jimmyliu@nycu.edu.tw
\r\n\t\t\tResearch Area: Modeling & Synthesis of Analog/Mixed-signal Circuits, High-level Power & Noise Modeling, Functional Verification for HDL Designs
Lee, Chen-Yi
\r\n\t\t\tChair Professor
\r\n\t\t\tInstitute of Electronics, NYCU
\r\n\t\t\tEmail: cylee@nycu.edu.tw
\r\n\t\t\tResearch Area: VLSI Algorithms & Architectures for High-throughput DSP Applications, Very Low-bit Coding, Multimedia Signal Processing, High-speed Networking, System-on-Chip Design Technologies
Wu, Tian-Li
\r\n\t\t\tAssociate Professor
\r\n\t\t\tInstitute of Electronics, NYCU
\r\n\t\t\tEmail: tlwu@nycu.edu.tw
\r\n\t\t\tResearch Area: GaN/SiC/GaO for power/B5G&6G applications, Sub-5 nm beyond CMOS, Reliability evaluation and degradation mechanism analysis, AI-assisted device design and reliability predictions
Huang, Po-Tsang
\r\n\t\t\tAssociate Professor
\r\n\t\t\tInstitute of Electronics, NYCU
\r\n\t\t\tEmail: bughuang@nycu.edu.tw
\r\n\t\t\tResearch Area: Digital Integrated Circuit Design, 3D Integrated Circuit Design, Memory Circuit Design, System on One Chip design, Forward-Looking Process Circuit Design Method
Lau, Gih-Keong
\r\n\t\t\tProfessor
\r\n\t\t\tDepartment of Mechanical Engineering, NYCU
\r\n\t\t\tEmail: mgklau@nycu.edu.tw
\r\n\t\t\tResearch Area: Engineering Mechanics, Dynamics, Vibration, Multidisciplinary FEM (Finite Element Methods), Bio-inspired Soft Robotics
Feng, Kai-Ten
\r\n\t\t\tProfessor
\r\n\t\t\tDepartment of Electronics and Electrical, NYCU
\r\n\t\t\tEmail: ktfeng@nycu.edu.tw
\r\n\t\t\tResearch Area: Wireless Communication Networks, Wireless Positioning Technologies, Embedded System Design
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\r\n\t\t\t

Chen, Ke-Horng
\r\n\t\t\tChair Professor
\r\n\t\t\tDepartment of Electronics and Electrical, NYCU
\r\n\t\t\tEmail: khchen@nycu.edu.tw
\r\n\t\t\tResearch Area: VLSI, Low-power Circuit Design, Mixed-signal Circuit Design, Power Management IC Design

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Chen, Chia-Hung
\r\n\t\t\tAssociate Professor
\r\n\t\t\tDepartment of Electronics and Electrical, NYCU
\r\n\t\t\tEmail: derekchen@nycu.edu.tw
\r\n\t\t\tResearch Area: Analog and Mixed-Signal Circuits Design
Hung, Chung-Chih
\r\n\t\t\tProfessor
\r\n\t\t\tDepartment of Electronics and Electrical, NYCU
\r\n\t\t\tEmail: cchung@nycu.edu.tw
\r\n\t\t\tResearch Area: Analog and Mixed-signal Integrated Circuit Design, Power Management IC Design, Biomedical IC Design
Tsai, Tsung-Heng
\r\n\t\t\tProfessor
\r\n\t\t\tDepartment of Electronics and Electrical, NYCU
\r\n\t\t\tEmail: henrytsai@nycu.edu.tw
\r\n\t\t\tResearch Area: Biomedical Sensing Systems, Energy Harvesting, Mixed-signal Integrated Circuits
Kuo, Chien-Nan
\r\n\t\t\tProfessor
\r\n\t\t\tDepartment of Electronics and Electrical, NYCU
\r\n\t\t\tEmail: cnkuo@nycu.edu.tw
\r\n\t\t\tResearch Area: SoC/SiP System Integration for Wireless Communications, Wireless Radar Detection System, Millimeter Wave Medical Imaging System
Lai, Ming-Chih
\r\n\t\t\tChair Professor
\r\n\t\t\tDepartment of Applied Mathematics, NYCU
\r\n\t\t\tEmail: mclai@nycu.edu.tw
\r\n\t\t\tResearch Area: Machine Learning, Scientific Computing, Fluid Mechanics, Numerical Methods for Partial Differential Equations
Chen, Yu-Chie
\r\n\t\t\tProfessor
\r\n\t\t\tDepartment of Applied Chemistry, NYCU
\r\n\t\t\tEmail: yuchie@nycu.edu.tw
\r\n\t\t\tResearch Area: Analytical Chemistry, Mass Spectrometry, Nano-biomedical Technologies
Yuen, Terry Yu-Ping
\r\n\t\t\tAssociate Professor
\r\n\t\t\tDepartment of Civil Engineering, NYCU
\r\n\t\t\tEmail: terryyyp@nycu.edu.tw
\r\n\t\t\tResearch Area: Earthquake Engineering and Resilience of Structures and Infrastructures, Tall Building Systems and Soil-pile-structure Interaction, Concrete and Masonry Structures, Mechanical Behaviour of Construction Materials, Numerical Methods in Solid and Structural Mechanics, Eco-efficient Construction Materials, Sustainable and Resilient Structural Engineering
Lin, Chih-Ping
\r\n\t\t\tChair Professor
\r\n\t\t\tDepartment of Civil Engineering, NYCU
\r\n\t\t\tEmail: cplin.ce@nycu.edu.tw
\r\n\t\t\tResearch Area: Engineering Geophysical Exploration, Geotechnical Monitoring, Soil Mechanics, Inverse Analysis and Reliability Assessment
Chang, Chia-Ching
\r\n\t\t\tProfessor
\r\n\t\t\tDepartment of Biological Science and Technology, NYCU
\r\n\t\t\tEmail: ccchang01@nycu.edu.tw
\r\n\t\t\tResearch Area: Nanobiotechnology, Molecular Biophysics, Computational Biophysics
Liu, Po-Tsun
\r\n\t\t\tChair Professor
\r\n\t\t\tDepartment of Photonics/ Institute of Electro-Optical Engineering, NYCU
\r\n\t\t\tEmail: ptliu@nycu.edu.tw
\r\n\t\t\tResearch Area: Flat-panel Display Technology, Semiconductor IC Fabrication, Memory Device Technology, Thin-film Transistor Technology, Flexible Electronics
Kuo, Hao-Chung
\r\n\t\t\tChair Professor
\r\n\t\t\tDepartment of Photonics/ Institute of Electro-Optical Engineering, NYCU
\r\n\t\t\tEmail: hckuo0206@nycu.edu.tw
\r\n\t\t\tResearch Area: Materials of III-V High-speed Semiconductors (GaAs, InP, GaN, etc.), Photonic Devices and Laser Technologies, MOCVD Epitaxy, GaN Vertical-cavity Surface-emitting Lasers (VCSEL), GaN Light-emitting Diodes (LED), GaN High Electron Mobility Transistors (HEMT), and Nano-photonic Materials & Devices
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