Translated by Szu-Yung Huang
Edited by Chance Lai
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Researchers from the Institute of Electronics at National Yang Ming Chiao Tung University (NYCU) have developed innovative deep-ultraviolet metalens, significantly advancing compact, lightweight optical components. This cutting-edge lens, boasting a thickness of just 380 nanometers—less than a human hair—delivers exceptional performance by focusing deep-ultraviolet (DUV) light with unparalleled precision.

Featured as the cover story in Nano Letters under the title ‘Deep-Ultraviolet AlN Metalens with Imaging and Ultrafast Laser Microfabrication Applications,’ this breakthrough opens new doors in fields ranging from semiconductor manufacturing to biomedical imaging and diagnostics.

Advancing DUV Technology: A Metalens Innovation

Deep-ultraviolet light, with a wavelength shorter than UVA and UVB, has long been integral to semiconductor processing and advanced imaging applications. However, the high costs and complexities of DUV components have limited their widespread use.

The NYCU Institute of Electronics team’s metalens addresses these challenges and achieves a remarkable milestone in DUV optical control. The lens demonstrates extraordinary capabilities by employing aluminum nitride—a material known for its high thermal resistance, chemical stability, and transparency to DUV light. For instance, it can produce nanoscale images and perform ultrafast laser engraving, both firsts in the field.

Assistant Professor Ming-Lun Tseng, who has dedicated years to developing metalens technology, highlights the transformative potential of this invention. “Deep-ultraviolet technologies are vital to basic research and industrial applications,” Tseng explains.

“Traditional DUV lenses used for precision laser machining can cost millions of NT dollars. Our approach using metasurfaces—consisting of intricately engineered semiconductor nanoantennas—enables precise light manipulation at a fraction of the cost, paving the way for broader adoption.”