<MachineOpenDataModel><subject>&lt;![CDATA[[Guangfu] Flip-chip Bonder]]&gt;</subject><detailContent>&lt;![CDATA[&lt;div class="ed_model05 clearfix">&#xd;
&lt;div class="ed_pic_right">&lt;img alt="Wafer to Wafer Bonder" src="/userfiles/ordch/images/20231016095326908.jpg" />&lt;/div>&#xd;
&#xd;
&lt;ul>&#xd;
	&lt;li class="ed_txt">&lt;strong>Flip-chip Bonder&lt;/strong>&#xd;
&#xd;
	&lt;ul>&#xd;
		&lt;li class="ed_txt">Abbreviation: Bonder&lt;/li>&#xd;
		&lt;li class="ed_txt">Brand: Smart Equipment Technology (SET)&lt;/li>&#xd;
		&lt;li class="ed_txt">Model: ACC&amp;mu;RA 100&lt;/li>&#xd;
	&lt;/ul>&#xd;
	&lt;/li>&#xd;
	&lt;li class="ed_txt">&lt;strong>Instrument expert: Prof. Chen, Guan-Neng&lt;/strong>&#xd;
	&lt;ul>&#xd;
		&lt;li class="ed_txt">ext. 31558&lt;/li>&#xd;
	&lt;/ul>&#xd;
	&lt;/li>&#xd;
	&lt;li class="ed_txt">&lt;strong>Instrument Operation Technician: Lin, Chia-Ray&lt;/strong>&#xd;
	&lt;ul>&#xd;
		&lt;li class="ed_txt">ext. 54241&lt;/li>&#xd;
		&lt;li class="ed_txt">Email &lt;a href="mailto:mailto:natasha22568@gmail.com" title="natasha22568@gmail.com">natasha22568@gmail.com&lt;/a>&lt;/li>&#xd;
	&lt;/ul>&#xd;
	&lt;/li>&#xd;
	&lt;li class="ed_txt">&lt;strong>Instrument Location: Room 135, Nano Facility Center&lt;/strong>&lt;/li>&#xd;
&lt;/ul>&#xd;
&lt;/div>]]&gt;</detailContent><dataClassName/><pubUnitName>Instrumentation Resource Center                                                                     </pubUnitName><posterDate/><updateDate>2025-02-21</updateDate><liaisonper/><liaisontel/><liaisonfax/><liaisonemail/><languageurl/><page1Title>Introduction</page1Title><page1>&lt;div class="ed_model01 clearfix">&#xd;
&lt;div class="ed_txt">&lt;strong>Instrument brand, model, year of purchase&lt;/strong>&lt;br />&#xd;
Brand: Smart Equipment Technology (SET)&lt;br />&#xd;
Model: ACC&amp;mu;RA 100&lt;br />&#xd;
Purchase period: 2018.11.05&lt;br />&#xd;
&lt;br />&#xd;
&lt;strong>Important Specifications&lt;/strong>&lt;/div>&#xd;
&#xd;
&lt;ol>&#xd;
	&lt;li class="ed_txt">Upper chip size: &amp;lt;10 mm;&amp;nbsp;Lower chip size: &amp;lt;100 mm&lt;/li>&#xd;
	&lt;li class="ed_txt">Temperature range: R.T. ~ 400 &amp;deg;C&lt;/li>&#xd;
	&lt;li class="ed_txt">Pressure range: 1 ~ 1000 N&lt;/li>&#xd;
	&lt;li class="ed_txt">Best alignment accuracy: &amp;plusmn;2 &amp;mu;m&lt;/li>&#xd;
	&lt;li class="ed_txt">Automatic alignment system&lt;/li>&#xd;
&lt;/ol>&#xd;
&lt;/div></page1><page2Title>Services and Opening Hours</page2Title><page2>&lt;div class="ed_model01 clearfix">&#xd;
&lt;div class="ed_txt">&lt;strong>Services&lt;/strong>&lt;br />&#xd;
Thermocompression bonding process (Chip-Chip, Chip-Wafer)&lt;br />&#xd;
&lt;br />&#xd;
&lt;strong>Opening Hours&lt;/strong>&lt;/div>&#xd;
&#xd;
&lt;ol>&#xd;
	&lt;li class="ed_txt">Monday to Friday: 08:00 ~ 17:00&lt;/li>&#xd;
	&lt;li class="ed_txt">Nights, Saturdays and Sundays: Closed&lt;/li>&#xd;
&lt;/ol>&#xd;
&lt;/div></page2><page3Title>System Open Level</page3Title><page3>&lt;div class="ed_model01 clearfix">&#xd;
&lt;div class="ed_txt">&lt;strong>System opening level&lt;/strong>&lt;/div>&#xd;
&#xd;
&lt;ol>&#xd;
	&lt;li class="ed_txt">General working hours: Level C&lt;/li>&#xd;
	&lt;li class="ed_txt">Night and holiday hours: Closed&lt;/li>&#xd;
&lt;/ol>&#xd;
&#xd;
&lt;div class="ed_txt">&lt;strong>&lt;u>Level Description&lt;/u>&lt;/strong>&lt;/div>&#xd;
&#xd;
&lt;ul>&#xd;
	&lt;li class="ed_txt">Level A: Open to students who need to use it. They can operate it on their own after training and assessment.&lt;/li>&#xd;
	&lt;li class="ed_txt">Level B: Each professor nominates one student for training, while the rest operate under those who have been trained. Professors with multiple students using the instrument can request an increase in the number of students receiving training.&lt;/li>&#xd;
	&lt;li class="ed_txt">Level C: The instrument administrator selects several students recommended by the professor to receive training. After passing the assessment, they can self-operate the instrument and be responsible for delegated operation service.&lt;/li>&#xd;
	&lt;li class="ed_txt">Level D: The laboratory&amp;#39;s technical staff only accept delegated services and are unavailable for general use.&lt;/li>&#xd;
&lt;/ul>&#xd;
&lt;/div></page3><page4Title>Charges</page4Title><page4>&lt;div class="ed_model19 clearfix">&#xd;
&lt;div class="table03">&#xd;
&lt;table class="ed_table caption-top" summary="Charge Standard">&#xd;
	&lt;tbody>&#xd;
	&lt;/tbody>&#xd;
	&lt;caption>Charging standards&lt;/caption>&#xd;
	&lt;tbody>&#xd;
		&lt;tr>&#xd;
			&lt;th scope="col">&amp;nbsp;&lt;/th>&#xd;
			&lt;th colspan="2" rowspan="1" scope="col">Delegated operation&lt;/th>&#xd;
			&lt;th colspan="2" rowspan="1" scope="col">Self-Operation&lt;/th>&#xd;
		&lt;/tr>&#xd;
		&lt;tr>&#xd;
			&lt;th scope="row">Unit&lt;/th>&#xd;
			&lt;td data-th="Delegated operation">Academic unit&lt;/td>&#xd;
			&lt;td data-th="Entrusted operation">Manufacturers and research units&lt;/td>&#xd;
			&lt;td data-th="Self-operated">Academic units&lt;/td>&#xd;
			&lt;td data-th="Operation by yourself">Manufacturers and research units&lt;/td>&#xd;
		&lt;/tr>&#xd;
		&lt;tr>&#xd;
			&lt;th scope="row">Start-up Fee&lt;/th>&#xd;
			&lt;td data-th="Delegated operation">NT$500&lt;/td>&#xd;
			&lt;td data-th="Delegated operation">NT$1,000&lt;/td>&#xd;
			&lt;td data-th="Operation by yourself">Not open&lt;/td>&#xd;
			&lt;td data-th="Operation by yourself">Not open&lt;/td>&#xd;
		&lt;/tr>&#xd;
		&lt;tr>&#xd;
			&lt;th scope="row">Bonding Process&lt;/th>&#xd;
			&lt;td data-th="Delegated operation">NT$1,000/time&lt;/td>&#xd;
			&lt;td data-th="Delegated operation">NT$5,000/time&lt;/td>&#xd;
			&lt;td data-th="Operation by yourself">Not open&lt;/td>&#xd;
			&lt;td data-th="Operation by yourself">Not open&lt;/td>&#xd;
		&lt;/tr>&#xd;
	&lt;/tbody>&#xd;
&lt;/table>&#xd;
&lt;br />&#xd;
Remark:&#xd;
&lt;ol>&#xd;
	&lt;li>Academic units refer to colleges and universities.&lt;/li>&#xd;
	&lt;li>There is no guarantee that the bonding process results will be successful due to the many factors that affect the bonding outcome, despite being calculated based on the actual number of bonding processes.&lt;/li>&#xd;
&lt;/ol>&#xd;
&lt;/div>&#xd;
&lt;/div></page4><page5Title>Management and Usage</page5Title><page5>&lt;div class="ed_model01 clearfix">&#xd;
&lt;div class="ed_txt">Management and Usage Methods:&lt;/div>&#xd;
&#xd;
&lt;ol>&#xd;
	&lt;li class="ed_txt">This system is mainly based on academic research and supplemented by services.&lt;/li>&#xd;
	&lt;li class="ed_txt">Please discuss with the technician one week before the working day when entrusting OEM services.&lt;/li>&#xd;
	&lt;li class="ed_txt">Sample delivery specifications:&#xd;
	&lt;ol>&#xd;
		&lt;li class="ed_txt">Volatile, corrosive, and toxic samples are prohibited.&lt;/li>&#xd;
		&lt;li class="ed_txt">Polymer and other materials must be placed on a hard substrate (Si, glass&amp;hellip;)&lt;/li>&#xd;
	&lt;/ol>&#xd;
	&lt;/li>&#xd;
	&lt;li class="ed_txt">The client will bear the maintenance costs if the instrument is damaged due to OEM samples.&lt;/li>&#xd;
&lt;/ol>&#xd;
&#xd;
&lt;div class="ed_txt">&lt;strong>Instrument training operation application instructions&lt;/strong>&lt;/div>&#xd;
&#xd;
&lt;div class="ed_txt">Eligibility for use: This instrument is only open to the person in charge of the instrument and the technical personnel of this laboratory&lt;br />&#xd;
&lt;br />&#xd;
&lt;strong>Instrument operation appointment:&lt;/strong>&lt;br />&#xd;
Please contact the management staff, student Lin, Chia-Ray TEL:03-5712121&amp;nbsp;#54241&lt;/div>&#xd;
&lt;/div></page5><page6Title/><page6/><page7Title/><page7/><page8Title/><page8/><docs/><images><images><fileurl>https://www.nycu.edu.tw/ord/en/app/machine/image?module=machine&amp;detailNo=1168397752825024512&amp;init=Y</fileurl><expFile>Flip-chip Bonder</expFile></images></images><videos/><audios/><resources><resources><relateURL>https://ord.edu.tw/ord/en/app/artwebsite/view?module=artwebsite&amp;id=2021&amp;serno=ebdd9934-00ef-4bee-9a8a-11f305100505</relateURL><relateName>Instrument List of GuanFu and Boai Campus</relateName></resources><resources><relateURL>https://www.nycu.edu.tw/ord/en/app/machine/list?module=machine&amp;id=2039</relateURL><relateName>Semiconductor Process</relateName></resources><resources><relateURL>https://nanofc.web.nycu.edu.tw/</relateURL><relateName>Nano Facility Center</relateName></resources></resources></MachineOpenDataModel>