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NYCU Office of Research and Development

Semiconductor Process

[Guangfu] Flip-chip Bonder

  • Update Date:2025-02-21
  • Units:Instrumentation Resource Center

[Guangfu] Thermal Evaporator & Glove Box (TEG)

  • Update Date:2025-02-20
  • Units:Instrumentation Resource Center

[Guangfu] Metal Etching System (MES)

  • Update Date:2025-02-20
  • Units:Instrumentation Resource Center

[Guangfu] KD-Sputter-Load luck (Sputter C)

  • Update Date:2025-02-20
  • Units:Instrumentation Resource Center
,total 4 records GO
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