The government launches the “Chip-driven Taiwan Industrial Innovation Program” to prepare for future technological challenges. (photo from Executive Yuan)

Early Foundations Build Long-term Strength

Dean Wang attributes NYCU’s success to its early investments in semiconductor research and talent cultivation. “Our environment is our greatest advantage,” he remarked. Since establishing Taiwan’s first electronics research institute in 1958, NYCU has been a cornerstone of national talent development. It has nurtured semiconductor elites in IC design, processes, and materials while attracting renowned scholars such as Simon M. Sze, Chun-Yen Chang, Mau-Chung Frank Chang, and Chung-Yu Wu.

This rich academic ecosystem fosters seamless communication and rapid team assembly, akin to a major hospital where specialists collaborate across disciplines. “It’s a platform that enables swift, multidisciplinary research teamwork,” Wang said.

Taking the eight research teams under the College of ECE’s Taiwan CbI projects as an example, the project leaders — Professors Pei-Chen Yu, Chen-Yi Lee, Ming-Dou Ker, Tian-Sheuan Chang, Wei-Zen Chen, Juinn-Dar Huang, Paul C.-P. Chao, and Chien-Nan Jimmy Liu — are experts in diverse fields such as large language models, IC design and EDA tools, and heterogeneous integration. While there may be some overlap among team members, their close collaboration and resource integration significantly enhance the teams’ strengths, maximizing their collective potential.

Research Excellence Drives Software-Hardware Integration

Wang highlighted Taiwan’s strengths in semiconductor manufacturing, with TSMC leading globally in wafer fabrication. However, he cautioned that Taiwan must enhance its software and IC design capabilities to stay competitive amid future technological revolutions.

NYCU’s eight semiconductor innovation projects focus on large language models (LLMs), IC design, EDA, and AI technologies. They also explore applications in autonomous vehicle systems, silicon photonics, and drone chips. “The integration of software and hardware will be the new key to semiconductor innovation,” Wang asserted. To maximize Taiwan’s wafer fabrication advantage, he advocates for integrating software and hardware considerations from the outset of chip design, avoiding the pitfalls of separate development processes.

Collaboration as the Key to Success

Industry partnerships, a hallmark of NYCU, play a critical role in semiconductor innovation projects. “Taiwan’s semiconductor prominence owes much to the strong ties between academia, government, and industry,” Wang noted. The ECE faculty at NYCU, comprising over 150 members, aligns with industry needs through “4H,” the four key drivers – High Performance, High Power, High Integration, and High Frequency. These strategies foster close collaboration with industry, driving the development of next-generation technologies.

However, transforming these partnerships into cohesive research themes takes time and effort. “The eight projects are not independent; they form a collective effort — a team battle,” Wang explained. This integrated approach underscores Taiwan’s ability to excel in global competition.

Transforming NYCU's ECE into a World-Class Research Hub

Wang envisions leveraging these projects to position NYCU's College of ECE as a global hub for semiconductor talent and research. Through the proposed "YFKA Program," the college aims to attract top talent from Japan, Southeast Asia, and Europe to join its international programs and innovation projects. "I hope NYCU's ECE College will become the Bell Labs of semiconductors, drawing global attention and investment to Taiwan," he said.

Looking ahead, Wang noted that global efforts are underway to identify materials that could surpass silicon in the next technological revolution. While Taiwan's overall semiconductor strength remains solid, he emphasized the need for improvements, particularly in IC design. This progress hinges on continued collaboration among academia, industry, and government to bring Taiwan's R&D achievements to the international stage and enhance its global visibility. "We must seize this moment to contribute to global technological advancements," Wang concluded.


In August 2024, the College of Electrical and Computer Engineering hosted the “Taiwan Chip-based Industrial Innovation Program” networking tea party. Industry partners in the sub-projects provided cutting-edge products and equipment and developed customized high-performance computing platforms and advanced teaching environments.

Please refer to the original text (Mandarin) for details.